Stock Code
301678
HENGHUI provides customers with one-stop packaging solutions, covering the entire process from wafer BG and sawing, packaging, FT testing, to IoT card personalization. The company has its own high-speed tin-plating line, and the packaging workshop is certified under the IATF16949 Quality Management System, with a monthly capacity of 35 million units. Main product series include DFN, QFN, and MP2, with a focus on etched leadframe packaging, committed to providing customers with high-reliability products and first-class services.
Process Introduction:
DoD (Die on Dummy) process refers to the die bonding method where the formal chip is placed on a Dummy chip. It is suitable for products where the incoming wafer has already been BG and sawed (cannot use DAF process for die bonding) and where the chip size exceeds the carrier size of the leadframe. It effectively solves issues such as overflows during die bonding and leakage after molding. Currently, DoD products have passed strict reliability tests and are ready for mass production.
Process Flow:
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